China Manufacturer Embedded Subscriber Identity Module Esim Card
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| Customization: | Available |
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| Conductive Type: | Unipolar Integrated Circuit |
| Integration: | VLSI |
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Basic Info.
- Operating Temperature
- 0℃ - 70℃
- Shape
- Flat
- Specification
- WLCSP 1.5*1.8 DFN8 5*6
- Trademark
- TONGXIN MICRO
- Origin
- China
- HS Code
- 8523521000
- Production Capacity
- 20, 000, 000 PCS/Year
Packaging & Delivery
- Package Size
- 10.00cm * 10.00cm * 8.00cm
- Package Gross Weight
- 0.100kg
Product Description
General Description
As the next generation of cutting-edge technologies converge and the intelligent interconnection of things accelerates, secure, reliable, flexible, and efficient global connectivity has become crucial for industry transformation.
The TMC series eSIM solutions feature high security, high performance, high reliability, and one-stop service. They have been successfully adopted by numerous well-known equipment manufacturers and are widely used in mobile communications terminals, wearable devices, automotive electronics, IoT terminals, providing solid connectivity support for the intelligent transformation of numerous industries.
eSIM Solution Advantages
1. The security chip offers a storage capacity of 512KB to 2MB and has passed international CC EAL6+, UnionPay chip security certification, National Security Level 2, and AEC-Q100 certifications, providing world-class hardware security protection.
2. The operating system (OS) complies with GSMA SGP.22 V2.5 and domestic communication standards, covers over 400 operators worldwide, supports up to 10 profile downloads, provides customized eIDs, and offers online updates for the eSIM COS, enabling more flexible full-lifecycle management at the software level.
3. In terms of production safety, we are the first domestic company to achieve GSMA SAS-UP certification for wafer-level personalized security chips. We support both wafer-level and packaged personalization, ensuring secure and controllable operations throughout the entire wafer-to-package process.
4. In terms of LPA compatibility, we offer LPA reference implementations based on multiple operating systems, including Android, Linux, and RTOS, significantly simplifying terminal device integration and helping customers quickly seize market opportunities.
Features
Small size:WLCSP | Large storage : 2 M | High security: CC EAL5+ |
Conforms to international standard eSIM security chip | ||
Personalized service | Full Compatible with | Mobile Phone Support |
High efficiency perso | 200+ operators | More Support Services |
eSIM Technology Architecture
eSIM product List
POS, CPE, watches | Mobile phones, laptops, POS | Mobile phones, watches, POS |
THD89-E512 TMC-E92-1 XXB | THD89-E2048 TMC-E92-4 XXB | THD89-E1500 TMC-E92-5 XXB |
Package: WLCSP 1.5*1.8 DFN8 5*6 capacity:512k Level: consumer grade, industrial grade | Package: WLCSP 2.0*2.5 P IN 33J 2.3*2.5 capacity:2M Level: consumer grade, automotive grade | Package: WLCSP 2.0*2.5 PIN 33G 2.5*2.7 capacity:1.5M Level: Consumer |
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